Specifications

• Capacity & Design A dual-channel kit featuring 32 GB (2×16 GB) modules with a sleek white aesthetic and vibrant RGB lighting.

• Performance Profile Rated at DDR5‑6000 MT/s with tight CL30‑40‑40 timings, operating at 1.35–1.4 V, balanced for both speed and efficiency.

• Compact Low-Profile Heat Spreader Designed with a compact heatsink (dimensions around 133.35 × 33.8 × 7.8 mm) that fits easily into compact builds and avoids interference with tall CPU coolers.

• Power & Stability Enhancements Equipped with a Power Management IC (PMIC) for efficient power delivery and On‑die ECC to maintain data integrity and stability during heavy usage.

• Lighting & Customization Fully customizable RGB lighting controllable via major motherboard RGB software or XPG Prime, offering modes like static, breathing, comet, and audio sync.

• Overclocking Support Compatible with both Intel XMP 3.0 and AMD EXPO, making it easy to activate optimized performance profiles with a single BIOS switch.

• Build Quality & Testing Constructed with high-quality ICs and PCBs and has undergone stringent validation to ensure compatibility and long-term reliability.

Warranty

• Limited Lifetime Warranty Offers long-term protection against manufacturing defects for the original purchaser.